Fujitsu Pentium processors
Introduction: May 1996
Fujitsu Microelectronics, Inc. (FMI) today introduced a pair of new Pentium processor-based MCM upgradeable modules for notebook PCs, combining Intel's Pentium MPU and PCI chip set with 256K L2 cache memory, voltage scaling circuitry, and discrete devices in a powerful, scaleable module that measures just 50mm x 50mm.
Fujitsu's two new notebook MCMs (the first to allow OEMs to offer upgradeable Pentium processor notebooks by simply replacing a single module) are available in two versions, the MCM-L/D (laminate deposition) and MCM-C (ceramic). Unlike other MCM-based architectures, modules do not require replacement of the computer's motherboard, and provide optimal thermal solutions for smaller, thinner notebook system designs. Intel Corporation worked closely with Fujitsu on the design and layout of both implementations. OEMs can now design notebook PCs that provide complete upgradeability for the entire Pentium processor family.
Fujitsu implemented both MCMs based on an Intel reference design of a Pentium processor/PCI-based subsystem for next-generation, ultraportable mobile computing applications. The companies have ensured that the MCMs take full advantage of today's MCM technology and Intel's SmartDie products to achieve a cost-effective MPU subsystem that consumes approximately half the area of existing implementations.
The new MCMs address the rapidly-changing performance objectives of OEMs for new generations of PC products, including dramatically smaller form factors, optimal heat dissipation, and high reliability. The reduced size of the modules allows OEMs to develop thinner notebooks with system motherboards that are smaller, less complex, and less expensive than current versions. The MCMs have already been evaluated by several major OEMs. Mass production is planned for the second half of 1996, in time to meet fall 1996 consumer market demand.
"Full-featured, Pentium processor-based notebooks are the fastest-growing segment of the PC market", said Dennis Stephenson, Interconnect Technology business manager for FMI. "Designers and OEMs require versatile, modular solutions that optimize system performance for a wide range of voltage levels, frequencies, and cache sizes. These MCMs provide very cost-effective solutions that enable OEMs to develop motherboard designs that provide a scaleable upgrade path for Pentium processors."
"A number of OEMs have been seeking solutions to their form-factor constraints in ultraportable PC applications", said Gregg Adkin, General Manager of Intel's Die Products Operation in Chandler, Ariz. "Our tested SmartDie products, coupled with Fujitsu's MCM technology, have enabled a viable MCM solution, as evidenced by these new offerings from Fujitsu".
Each MCM integrates a total of 135 components, including a Pentium processor and supporting chip set, with 256KB L2 cache memory, precision voltage regulator and thermistor. Both versions support a 33MHz PCI interface and a host bus frequency up to 66MHz. This permits the use of Intel processor frequencies from 75MHz to 133MHz, and enables scaling to support future processors and frequencies.
The PCI and system memory interfaces are supported using a standard, low-profile, board-to-board connector from JAE that simplifies the mounting process and upgradeability.
The MCM-C module applies existing wire bonding technology in 16 layers built on alumina ceramic substrate. Chips are mounted using Fujitsu's chip-on-board (COB) and regular solder reflow process for SMT components. The MCM-C is slightly thicker, at 50mm x 50mm x 10.5mm.
Pricing for either MCM begins at under $50, exclusive of all components, and dependent on integration requirements and volume. Samples of the MCM-C and MCM-L/D are available now. For OEM designs that may require some re-design, NRE costs will be nominal.
Source: www.businesswire.com (news published on May 1, 1996)